{"id":460,"date":"2026-04-27T07:28:21","date_gmt":"2026-04-27T07:28:21","guid":{"rendered":"https:\/\/punker.themeforest.cn\/?page_id=460"},"modified":"2026-05-22T06:36:08","modified_gmt":"2026-05-22T06:36:08","slug":"aluminum-nitride-aln-substrate-slicing","status":"publish","type":"page","link":"https:\/\/punker.themeforest.cn\/ko\/products\/aluminum-nitride-aln-substrate-slicing\/","title":{"rendered":"\uc9c8\ud654 \uc54c\ub8e8\ubbf8\ub284(AlN) \uae30\ud310 \uc2ac\ub77c\uc774\uc2f1"},"content":{"rendered":"
\n\t\t\t\t
\n\t\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t

Semiconductor Slicing<\/h2>\t\t\t\t<\/div>\n\t\t\t\t\t\n
\n\t\t\t\t
\n\t\t\t\t\t

High-Precision Diamond Wire Cutting Systems for AlN Wafer Processing in Semiconductor Manufacturing<\/p>\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t

\n\t\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t \t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t
\n\t\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t\t\t\t\t

Aluminum Nitride (AlN) substrates are critical high-performance ceramic materials for power electronics and semiconductor packaging. Precision slicing of AlN wafers helps maintain material integrity, minimize thermal resistance, and ensure reliable performance in high-power applications, which has a positive effect on boosting device efficiency and yield. Among the different types of AlN processing, ultra-thin wafer slicing, multi-layer substrate dicing, and custom component cutting are the most widely used in the industry. In high-volume production lines, the individual processing steps are integrated into automated stations. The AlN blanks are fed through diamond wire cutting systems and processed by various precision operations such as high-tension wire slicing, stress-free cutting, surface grinding, etc.<\/p>

Diamond wire cutting systems for AlN substrate slicing process the ceramic material after blank preparation, often by means of ultra-precise wire tension control and low-stress cutting close to the final tolerance. High-efficiency cutting systems for ultra-thin wafers, thick substrates or custom components must generate extremely tight dimensional accuracy \u2013 with minimal kerf loss \u2013 and have high process stability at the same time. At the same time, AlN cutting systems should be able to handle the high hardness and brittleness of ceramic materials and have a compact footprint to guarantee the most space-saving production line design possible.<\/p><\/div><\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t

\n\t\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t

ewirexon AlN Substrate Slicing Solution<\/h2>\t\t\t\t<\/div>\n\t\t\t\t
\n\t\t\t\t\t\t\t
\n\t\t\t\n\t\t\t\t\t\t<\/span>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t
\n\t\t\t\t
\n\t\t\t\t\t\t\t
\n\t\t\t\t\t\t
\n\t\t\t\t\n\t\t\t\t\t
AlN Slicing Diamond Wire Cutting Systems <\/div><\/span>\n\t\t\t\t\t\t\t\n\t\t\t<\/path><\/svg><\/span>\n\t\t\t<\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t\t\t\t\t

High-precision, low-kerf-loss and compact diamond wire cutting systems from ewirexon help semiconductor manufacturers achieve ultra-tight dimensional accuracy and thus an optimal slicing result. At the same time, material waste remains low in the main production mode. The cutting systems, made of high-rigidity steel frames, are wear-resistant and, thanks to their optimized wire tension control, ideally suited for flexible processing of various AlN substrate thicknesses or orientations of the cutting direction. Due to its stable mechanical structure, it requires lower maintenance frequency than industry-standard cutting systems. The combination of precision wire guide geometry and optimized inlet cone ensures minimal sub-surface damage. Thanks to the reduced footprint of the machine, particularly space-saving production line designs can be realized. The AlN cutting systems have been tested for cyclic operating conditions to simulate applications with a high number of start-stops, such as are common in semiconductor wafer manufacturing.<\/p><\/div><\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t

\n\t\t\t\t\n\t\t\t\t\t
Benefits <\/div><\/span>\n\t\t\t\t\t\t\t\n\t\t\t<\/path><\/svg><\/span>\n\t\t\t<\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t\t\t\t\t

Reduced material waste and production lossthanks to precision-optimized wire path geometry of the cutting systems, minimizing kerf loss and sub-surface damage.<\/p>

Savings in production costs and material yield improvementpossible, as the high-precision cutting blades ensure high material utilization with consistent process stability.<\/p>

Optimum slicing resultWhen used in the specially matched production line, high dimensional accuracy and ultra-smooth surface quality are generated, enabling fast and efficient wafer processing.<\/p>

Reduction of service costs due to the long service life of the cutting systemswhich can be achieved thanks to high-rigidity frame structure and high component strength confirmed by cycle tests.<\/p><\/div><\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t

\n\t\t\t\t\n\t\t\t\t\t
Applications <\/div><\/span>\n\t\t\t\t\t\t\t\n\t\t\t<\/path><\/svg><\/span>\n\t\t\t<\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t
\n\t\t\t\t
\n\t\t\t\t\t\t\t\t\t
  • Ultra-thin AlN substrate slicing for power electronics<\/li>
  • AlN wafer dicing for semiconductor packaging<\/li>
  • Multi-layer AlN ceramic component processing<\/li>
  • High-volume production lines for technical ceramics<\/li><\/ul><\/div><\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t\t
    \n\t\t\t\t\n\t\t\t\t\t
    Technical Data <\/div><\/span>\n\t\t\t\t\t\t\t\n\t\t\t<\/path><\/svg><\/span>\n\t\t\t<\/path><\/svg><\/span>\n\t\t<\/span>\n\n\t\t\t\t\t\t<\/summary>\n\t\t\t\t
    \n\t\t\t\t
    \n\t\t\t\t\t\t\t\t\t<\/colgroup>
    NO.<\/td>Parameter<\/td>Specification<\/td><\/tr>
    1<\/td>Model<\/td>TCQF400LNC-FM-HL<\/td><\/tr>
    2<\/td>Cutting Principle<\/td>Endless diamond wire \/ Physical cutting<\/td><\/tr>
    3<\/td>Cutting Functions<\/td>Slicing \/ Angle & Profile Cutting<\/td><\/tr>
    4<\/td>Maximum Workpiece Size(mm)<\/td>\u03a6600mm, Height 500mm<\/td><\/tr>
    5<\/td>Worktable Size(mm)<\/td>\u00d8380 \u8f6c\u53f0<\/td><\/tr>
    6<\/td>Cutting Planarity Accuracy(mm)<\/td>0.08<\/td><\/tr>
    7<\/td>Surface Roughness(\u03bcm)<\/td>Ra 0.8\u03bcm<\/td><\/tr>
    8<\/td>Wire Specification(mm)<\/td>\u00d80.65\u20131.0\/2580<\/td><\/tr>
    9<\/td>Tension System<\/td>Constant Wire Tension Control<\/td><\/tr>
    10<\/td>Guide Wheel Quantity<\/td>4 wheels<\/td><\/tr>
    11<\/td>Drive Motor<\/td>Servo motor<\/td><\/tr>
    12<\/td>Wire Speed (m\/s)<\/td>51Max\uff08Adjustable\uff09<\/td><\/tr>
    13<\/td>Total Power<\/td>2.8<\/td><\/tr>
    14<\/td>Voltage<\/td>220v 50Hz<\/td><\/tr>
    15<\/td>Control System<\/td>Custom-developed Tongcheng T32 system<\/td><\/tr>
    16<\/td>Footprint (L\u00d7W\u00d7H)(mm)<\/td>1350\u00d71066\u00d71968<\/td><\/tr>
    17<\/td>Gross Weight kg<\/td>720<\/td><\/tr><\/tbody><\/table>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/details>\n\t\t\t\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t
    \n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\"\"\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t
    \n\t\t\t\t\t
    \n\t\t
    \n\t\t\t\t
    \n\t\t\t\t\t

    Case Study: AlN Substrate Slicing<\/h2>\t\t\t\t<\/div>\n\t\t\t\t
    \n\t\t\t\t\t\t\t
    \n\t\t\t\n\t\t\t\t\t\t<\/span>\n\t\t<\/div>\n\t\t\t\t\t\t<\/div>\n\t\t\t\t
    \n\t\t\t\t\t\t\t\t\t

    A semiconductor manufacturer partnered with ewirexon to upgrade their AlN slicing process, achieving higher yield, lower material waste, and consistent precision in production.<\/p>

    Want to know more project cases? Feel free to write us!<\/p><\/div><\/div><\/div><\/div>\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t

    \n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t
    \n\t\t\t\t
    \n\t\t\t\t
    \n\t\t\t\t\t \t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>","protected":false},"excerpt":{"rendered":"

    High-Precision Diamond Wire Cutting Systems for AlN Wafer Processing in Semiconductor Manufacturing Aluminum Nitride (AlN) substrates are critical high-performance ceramic materials for power electronics and semiconductor packaging. Precision slicing of AlN wafers helps maintain material integrity, minimize thermal resistance, and ensure reliable performance in high-power applications, which has a positive effect on boosting device efficiency […]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":331,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"elementor_header_footer","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-460","page","type-page","status-publish","hentry"],"acf":[],"_hostinger_reach_plugin_has_subscription_block":false,"_hostinger_reach_plugin_is_elementor":false,"_links":{"self":[{"href":"https:\/\/punker.themeforest.cn\/ko\/wp-json\/wp\/v2\/pages\/460","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/punker.themeforest.cn\/ko\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/punker.themeforest.cn\/ko\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/punker.themeforest.cn\/ko\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/punker.themeforest.cn\/ko\/wp-json\/wp\/v2\/comments?post=460"}],"version-history":[{"count":10,"href":"https:\/\/punker.themeforest.cn\/ko\/wp-json\/wp\/v2\/pages\/460\/revisions"}],"predecessor-version":[{"id":1163,"href":"https:\/\/punker.themeforest.cn\/ko\/wp-json\/wp\/v2\/pages\/460\/revisions\/1163"}],"up":[{"embeddable":true,"href":"https:\/\/punker.themeforest.cn\/ko\/wp-json\/wp\/v2\/pages\/331"}],"wp:attachment":[{"href":"https:\/\/punker.themeforest.cn\/ko\/wp-json\/wp\/v2\/media?parent=460"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}