Semiconductor Slicing
Precision Diamond Wire Cutting for Solar Wafer Production
High-efficiency N-type and P-type solar wafers are the core of next-generation photovoltaic modules. Precision diamond wire cutting is critical to producing ultra-thin, high-quality wafers that maximize cell conversion efficiency and material yield. This process has replaced traditional sawing, delivering lower kerf loss, higher throughput, and superior surface quality for mass PV manufacturing.
Our diamond wire systems ensure consistent wafer thickness, minimal breakage, and controlled surface damage, enabling high-throughput production of ultra-thin wafers while meeting the strict quality requirements of modern solar cell technologies.
Precision Diamond Wire Cutting for High-Efficiency Solar Wafers
Our diamond wire cutting solutions are tailored for high-efficiency PV wafer production, delivering ultra-thin, high-quality wafers that directly boost solar cell conversion efficiency. The systems feature advanced wire path optimization and real-time monitoring, ensuring consistent thickness, flatness, and surface quality for N-type TOPCon, HJT, and other next-generation solar cells. With low-damage cutting technology, they minimize wafer warpage and micro-cracks, significantly improving cell yield and module performance.
High-efficiency PV Wafer Processing
Core Benefits
- Ultra-Thin Wafer Capability: Achieve stable slicing of wafers as thin as 100μm, reducing silicon usage and lowering cell costs.
- Superior Surface Quality: Low-damage cutting eliminates the need for extensive post-processing, simplifying production steps.
- High Yield & Low Breakage: Intelligent cutting algorithms reduce wafer breakage rate to below 1%, maximizing production yield.
- Energy & Cost Savings: High-efficiency cutting design reduces power consumption per wafer, cutting operational expenses.
Application Scenarios
- High-efficiency N-type/P-type solar wafer manufacturing
- Ultra-thin wafer processing for HJT, TOPCon, and IBC cells
- Wafer slicing for bifacial and high-power PV modules
Technical Specifications
| NO. | Parameter | Specification |
| 1 | Model | TCQF15030CNC |
| 2 | Cutting Principle | Endless diamond wire / Physical cutting |
| 3 | Cutting Functions | Slicing / 2D Contour Cutting |
| 4 | Maximum Workpiece Size(mm) | 1200 × 1000 × 1000 mm(L×W×H) |
| 5 | Worktable Size(mm) | 1500×300 |
| 6 | Cutting Planarity Accuracy(mm) | 0.1 |
| 7 | Surface Roughness(μm) | Ra 0.8 μm |
| 8 | Wire Specification(mm) | Ø0.65–1.0/6250 |
| 9 | Tension System | Constant Wire Tension Control |
| 10 | Guide Wheel Quantity | 4 wheels |
| 11 | Drive Motor | Servo motor |
| 12 | Wire Speed (m/s) | 51Max（Adjustable） |
| 13 | Total Power | 3.6 |
| 14 | Voltage | 220v 50Hz |
| 15 | Control System | Custom-developed Tongcheng T33 system |
| 16 | Footprint (L×W×H)(mm) | 3200×1500×1500 |
| 17 | Gross Weight kg | 3200 |
