Semiconductor Slicing
Precision Cutting for New Energy Battery Materials
Advanced new energy batteries rely on precision processing of electrode, separator, and solid-state battery materials. Diamond wire cutting is the ideal solution for slicing hard, brittle, and high-value battery materials, delivering ultra-low kerf loss, damage-free surfaces, and tight dimensional accuracy.
Our cutting systems support customized processing for lithium-ion, solid-state, and next-gen energy storage materials, enabling high-precision slicing for R&D prototyping and mass production, while maximizing material utilization and production efficiency.
Custom Diamond Wire Cutting for New Energy Battery Materials
Our precision cutting systems are designed for the complex processing needs of new energy battery materials, supporting lithium-ion, solid-state, and next-generation energy storage technologies. They deliver damage-free, high-precision slicing for hard, brittle, and high-value battery materials, including electrode foils, ceramic separators, and solid-state electrolyte components. With customizable cutting paths and tension control, they meet the diverse R&D and mass production requirements of battery manufacturers.
New Energy Battery Material Cutting
Key Strengths
- Damage-Free Processing: Ultra-low stress cutting preserves material integrity, critical for battery performance and safety.
- High Precision & Tight Tolerance: Achieve micron-level dimensional accuracy, ensuring consistency in battery component production.
- Versatile Material Compatibility: Supports a wide range of battery materials, from lithium electrodes to solid-state ceramics.
- Scalable from R&D to Mass Production: Flexible configurations for lab prototyping and high-volume manufacturing lines.
Use Cases
- Lithium-ion battery electrode and component slicing
- Solid-state battery electrolyte and ceramic substrate cutting
- New energy storage material R&D and pilot production
Technical Specifications
| NO. | Parameter | Specification |
| 1 | Model | TCQF400LNC-FM-HL |
| 2 | Cutting Principle | Endless diamond wire / Physical cutting |
| 3 | Cutting Functions | Slicing / Angle & Profile Cutting |
| 4 | Maximum Workpiece Size(mm) | Φ600mm, Height 500mm |
| 5 | Worktable Size(mm) | Ø380 转台 |
| 6 | Cutting Planarity Accuracy(mm) | 0.08 |
| 7 | Surface Roughness(μm) | Ra 0.8μm |
| 8 | Wire Specification(mm) | Ø0.65–1.0/2580 |
| 9 | Tension System | Constant Wire Tension Control |
| 10 | Guide Wheel Quantity | 4 wheels |
| 11 | Drive Motor | Servo motor |
| 12 | Wire Speed (m/s) | 51Max（Adjustable） |
| 13 | Total Power(kW) | 2.8 |
| 14 | Voltage | 220v 50Hz |
| 15 | Control System | Custom-developed Tongcheng T32 system |
| 16 | Footprint (L×W×H)(mm) | 1350×1066×1968 |
| 17 | Gross Weight kg | 720 |
