Product Portfolio | Diamond Wire Cutting Equipment


High-efficiency Precision Cutting for Advanced Hard & Brittle Materials

製品紹介

当社の製品ラインナップ

Need help finding the right diamond wire saw?

Our Application Experts will be happy to assist you in finding the optimum fan wheel for your specific application.

当社の製品ラインナップ

エンドレス・ダイヤモンドワイヤーソー

当社のエンドレスダイヤモンドワイヤーソーは、極めて安定した走行精度と少ない切削損失、そして優れた切断面の仕上げが特徴です。.
詳細はこちら >

ダイヤモンド製マルチワイヤーソー

当社のダイヤモンド多線式ソーは、高い量産効率と卓越した歩留まりに加え、極めて低いTTV制御性能を特徴としています。.
詳細はこちら >

卓上型エンドレスループ式ダイヤモンドワイヤーソー

当社の卓上型エンドレスループ式ダイヤモンドワイヤーソーは、コンパクトな卓上型構造、高精度な硬質・脆性材料の切断性能、そして滑らかな切断面仕上げを特徴としており、実験室での研究や小ロットの加工に最適です。.
詳細はこちら >

消耗品および補助加工機器

エンドレスダイヤモンドワイヤーソーおよびダイヤモンドマルチワイヤーソー用の消耗品および補助加工機器は、高い互換性、安定した性能、そして実験室での切断から量産までのあらゆるニーズに完璧に対応できる点が特徴です。.
詳細はこちら >

エンドレス・ダイヤモンドワイヤーソー

Each series of endless diamond wire saw from our factory has its own special advantages that show their full potential in hard brittle material cutting applications — ultra stable running performance, ultra low kerf loss and perfect smooth cutting surface round off the profile of these machines.

NO.ParameterSpecification
1ModelTCQF400LNC-FM-HL
2Cutting PrincipleEndless diamond wire / Physical cutting
3Cutting FunctionsSlicing / Angle & Profile Cutting
4Maximum Workpiece Size(mm)Φ600mm, Height 500mm
5Worktable Size(mm)Ø380 turntable
6Cutting Planarity Accuracy(mm)0.08
7Surface Roughness(μm)Ra 0.8μm
8Wire Specification(mm)Ø0.65–1.0/2580
9Tension SystemConstant Wire Tension Control
10Guide Wheel Quantity4 wheels
11Drive MotorServo motor
12Wire Speed (m/s)51Max(Adjustable)
13Total Power(kW)2.8
14Voltage220v 50Hz
15Control SystemCustom-developed Tongcheng T32 system
16Footprint (L×W×H)(mm)1350×1066×1968
17Gross Weight kg720

Not sure which diamond wire cutting equipment fits your needs?

Our application engineers gladly help you choose the best solution for your industrial processing requirements.

ダイヤモンド製マルチワイヤーソー

 

Our full-series diamond multi-wire saw delivers exclusive performance advantages for professional wafer slicing scenarios, featuring stable mass production running, minimized TTV deviation and outstanding material yield efficiency to define premium processing standards.

NO.ParameterSpecification
1ModelEW-D2236
2Workpiece Carrier Plate Size110 × 360 mm
3Max Workpiece Cutting Envelope220 × 360 mm
4Cutting Dimensional Accuracy±0.02 mm
5Worktable Feed Speed Range0 ~ 1000 mm/h
6Worktable Vertical Travel200 mm
7Guide Wheel Quantity8 Wheels
8Total Rated Power22 kW
9Footprint (L×W×H)1942 × 1522 × 2200 mm
10Gross Weight4800 kg

Not sure which diamond wire cutting equipment fits your needs?

Our application engineers gladly help you choose the best solution for your industrial processing requirements.

Desktop Endless Loop Diamond Wire Saw

Each model of desktop endless loop diamond wire saw features tailored advantages that fully shine in laboratory precision cutting applications — compact tabletop layout, ultra-high cutting accuracy and flawless edge finish perfectly define its professional performance profile.

NO.ParameterSpecification
1Model(Customizable, e.g. EW-200)
2Cutting PrincipleDiamond Wire Mechanical Cold Cutting
3Cutting FunctionSlicing
4Max Workpiece Dimension (L×W×H)150 × 150 × 150 mm
5Worktable Size (L×W)160 × 160 mm
6Cutting Flatness Accuracy≤ 0.1 mm
7Surface RoughnessRa 0.8 μm
8Diamond Wire SpecificationΦ0.5 × 1797 mm (Dia. Range: 0.35~0.8 mm)
9Tension SystemServo Tension Control
10Guide Wheel Quantity3 wheels
11Drive MotorCustom Servo Motor
12Spindle Speed4500 rpm
13Main Motor Power1.1 kW
14Total Power Consumption1.5 kW
15Power Supply220 V / 50 Hz
16Control SystemSelf-developed Tongcheng T30
17Footprint (L×W×H)Approx. 850 × 800 × 950 mm
18Gross WeightApprox. 560 kg

Not sure which diamond wire cutting equipment fits your needs?

Our application engineers gladly help you choose the best solution for your industrial processing requirements.

Consumables & Auxiliary Processing Equipment

Each series of consumables & auxiliary processing equipment offers exclusive compatibility advantages that perform perfectly in precision cutting workflows — full model matching grade, stable surface finishing effect and seamless integration for both lab machines and mass production saws round off the complete supporting solution.

ItemSpecification & Description
Diamond Loop WireCustom grit size & wire diameter for cutting ceramics, semiconductors and hard brittle materials
Cutting FluidWater-based cooling and lubricating solution with anti-corrosion and low volatility properties
Wire Guide RollerHigh-precision wear-resistant ceramic roller ensuring stable wire running
Fixing Jig & FixtureCustom tooling for positioning and clamping irregular workpieces
Edge Chamfering MachineProfessional equipment for precision edge chamfering of brittle material substrates
Lapping & Polishing MachinePrecision lapping equipment for surface finishing and flatness calibration
Cleaning AuxiliariesDetergents for dust removal and surface cleaning of post-cutting workpieces
Maintenance Spare PartsBackup bearings, sensors and protective covers for daily equipment maintenance

Not sure which diamond wire cutting equipment fits your needs?

Our application engineers gladly help you choose the best solution for your industrial processing requirements.

Do you have a question regarding your order or a specific article number?

セレーナ

セールス・マネージャー

電話/whatsapp:

+86-17521086752

Eメール

serena@ewirexon.com

住所

中国上海市奉賢区平林支路8号